The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg)

Bloomberg:
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act  —  - Firm to get $450 million Chips Act grant, $500 million loan  — Indiana facility focused on advanced packaging, research

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